Semiconductor Metrology Solution
Precision Metrology for Semiconductor Manufacturing
Measurement solutions for semiconductor equipment, precision components and critical parts where dimensional accuracy, geometry and consistency matter.
Measure the components behind semiconductor production.
Semiconductor manufacturing depends on equipment and components that must perform consistently across demanding production environments.
From precision-machined parts and ceramic components to valves, fixtures, consumables and wafer-handling hardware, dimensional variation can affect fit, alignment and equipment performance.
GTS combines ZEISS metrology technologies with application knowledge to help manufacturers inspect critical components, verify dimensional requirements and generate measurement data for engineering and quality decisions.
Metrology for the components that keep semiconductor equipment running.
Different components require different measurement approaches. GTS helps identify the appropriate inspection technology based on geometry, material, accessibility and measurement requirements.
Semiconductor Equipment Components
Verify critical dimensions, mounting features, geometry and relationships between features.
Precision-Machined Parts
Measure holes, diameters, positions, datums, form and geometric tolerances.
Quartz & Ceramic Components
Inspect delicate geometries and complex features using non-contact optical measurement where appropriate.
Polymer & PTFE Components
Identify dimensional variation, deformation, shrinkage and full-surface deviations.
Valves & Actuators
Inspect bores, interfaces, sealing surfaces and moving features.
Consumable Parts
Compare supplied components against drawings, CAD data or approved reference parts.
Wafer-Handling Components
Verify fit, alignment, geometry and dimensional consistency for handling and automation components.
Tooling & Fixtures
Validate critical locations, datums and geometric relationships between fixture components.
Semiconductor Packaging Components
Support dimensional, geometric and internal inspection of precision packaging-related components.
Small features. Tight tolerances. Complex geometries.
Semiconductor equipment components can combine tight dimensional requirements with difficult-to-access features, complex surfaces and demanding materials.
Tight Dimensional Tolerances
Small & Complex Features
Flatness & Parallelism
Freeform Surfaces
Difficult-to-Access Areas
Internal Structures
Surface Geometry
Repeatable Inspection
CAD Comparison
Reference-Part Comparison
The right measurement technology for the right component.
CMM, optical 3D scanning and industrial CT are complementary technologies. The inspection method should follow the measurement requirement.
Coordinate Measuring Machine
For components where defined dimensions, datums and geometric relationships are critical.
- Dimensional measurement
- Geometric tolerances
- Flatness & parallelism
- Position & orientation
- Repeatable inspection
Optical 3D Scanning
For complex surfaces, detailed geometry and full-field inspection against CAD.
- Complex geometries
- Freeform surfaces
- Full-field inspection
- CAD comparison
- Deviation mapping
Industrial CT
For non-destructive inspection where important features are located inside the component.
- Internal structures
- Hidden features
- Voids & defects
- Wall-thickness analysis
- Internal & external inspection
Metrology throughout the component lifecycle.
Measurement can support quality decisions before a component enters production, during manufacturing and when parts are repaired, refurbished or investigated.
Incoming Inspection
Verify supplied components against requirements.
Supplier Quality
Independently verify critical dimensions.
First Article
Validate new parts, suppliers or processes.
Production
Monitor critical dimensions and variation.
Failure Analysis
Investigate dimensional or internal deviations.
Refurbishment
Support requalification after repair or refurbishment.
Industrial metrology solutions for semiconductor applications.
GTS provides access to ZEISS metrology technologies for dimensional measurement, optical 3D inspection and industrial CT.
ZEISS SPECTRUM
Dimensional inspection of defined geometries, features and geometric relationships.
ZEISS ATOS Q
Optical 3D measurement for detailed surface geometry and CAD comparison.
ZEISS GOM Scan 1
Compact optical 3D measurement for smaller components and detailed surface inspection.
ZEISS METROTOM 1
Non-destructive inspection of internal and external structures, including hidden features.
ZEISS INSPECT
Analyse 3D measurement data, deviations, dimensions and inspection results.
ZEISS CALYPSO
Dimensional measurement workflows for ZEISS CMM inspection applications.
Measurement data that supports better engineering decisions.
From component qualification to refurbishment and failure analysis, metrology provides an objective basis for understanding how a component compares with its intended specification.
Dimensional Verification
Verify critical dimensions and geometric relationships against engineering requirements.
CAD Comparison
Identify localised deviations between measured geometry and the intended CAD model.
Repeatability
Support consistent inspection across components, batches and suppliers.
Traceability
Generate documented measurement results for quality and engineering records.
Supplier Qualification
Independently compare supplied components against defined engineering requirements.
Requalification
Establish measurable evidence following repair, refurbishment or component modification.
Have a part you need to inspect?
Discuss your component, material, tolerance requirements and inspection objectives with our ZEISS metrology specialists.